Imagen 1 de 1
Galería
Imagen 1 de 1
¿Quieres vender uno?
Interconnects in VLSI Design by Hartmut Grabinski: New
USD188,13
Aproximadamente162,59 EUR
Estado:
Nuevo
Libro nuevo, sin usar y sin leer, que está en perfecto estado; incluye todas las páginas sin defectos. Consulta el anuncio del vendedor para obtener más información.
- ¡Cómpralo ya!Interconnects in VLSI Design by Hartmut Grabinski: New
Oops! Looks like we're having trouble connecting to our server.
Refresh your browser window to try again.
Envío:
Gratis Standard Shipping.
Ubicado en: Sparks, Nevada, Estados Unidos
Entrega:
Entrega prevista entre el vie. 8 ago. y el jue. 14 ago. a 94104
Devoluciones:
30 días para devoluciones. El comprador paga el envío de la devolución..
Pagos:
Compra con confianza
El vendedor asume toda la responsabilidad de este anuncio.
N.º de artículo de eBay:363591536931
Última actualización el 05 dic 2024 13:05:22 H.EspVer todas las actualizacionesVer todas las actualizaciones
Características del artículo
- Estado
- Book Title
- Interconnects in VLSI Design
- Publication Date
- 2000-10-31
- Pages
- 236
- ISBN
- 9780792379973
Acerca de este producto
Product Identifiers
Publisher
Springer
ISBN-10
0792379977
ISBN-13
9780792379973
eBay Product ID (ePID)
1913835
Product Key Features
Number of Pages
VII, 236 Pages
Language
English
Publication Name
Interconnects in Vlsi Design
Subject
Electronics / Semiconductors, Electronics / Circuits / Vlsi & Ulsi, Cad-Cam, Electronics / Circuits / General, Electrical
Publication Year
2000
Type
Textbook
Subject Area
Computers, Technology & Engineering
Format
Hardcover
Dimensions
Item Weight
40.9 Oz
Item Length
9.6 in
Item Width
6.7 in
Additional Product Features
Intended Audience
Scholarly & Professional
LCCN
00-046973
Dewey Edition
21
Number of Volumes
1 vol.
Illustrated
Yes
Dewey Decimal
621.39/5
Table Of Content
Recent Development in Interconnect Modeling.- Study of Parallel Plane Mode Excitation at a Double-Layer Via Interconnect Using the FDTD Method.- A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology.- Measurement of Signal Integrity within Deep-Submicron Interconnect.- Considering Magnetic Interference in Board-Level Interconnect Design.- Input Shape Influence over Interconnect Performances.- Comparison of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations.- Black-Box Modeling of Digital Devices>.- Advanced Modeling of Nonuniform Interconnects.- Modeling of Passive Components for Radio Frequency Applications.- Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards.- Characteristic Impedance Measurement on Silicon.- Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects.- Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems.- Quantifying the Impact of Optical Interconnect Latency on the Performance of Optoelectronic FPGA's.- PIN CMOS Receivers for Optical Interconnects.- BICMOS Receiver OEIC for Optical Interconnect.- Electrical/Optical Circuit Boards: Technology - Design - Modeling.
Synopsis
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects., This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua- tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des- cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
LC Classification Number
TK7867-7867.5
Descripción del artículo del vendedor
Información de vendedor profesional
Acerca de este vendedor
AlibrisBooks
98,6% de votos positivos•1,9 millones artículos vendidos
Registrado como vendedor profesional
Votos de vendedor (513.985)
- m***m (2298)- Votos emitidos por el comprador.Últimos 6 mesesCompra verificadaI’m thrilled with my recent purchase . The website was user-friendly, and the product descriptions were accurate. Customer service was prompt and helpful, answering all my questions. My order arrived quickly, well-packaged, and the product exceeded my expectations in quality. I’m impressed with the attention to detail and the overall experience. I’ll definitely shop here again and highly recommend from this seller to others. Thank you for a fantastic experience!
- a***n (45)- Votos emitidos por el comprador.Últimos 6 mesesCompra verificadaMistakenly ordered a paperback that I thought was a hardcover, not sellers fault; it was described properly on the listing. Seller still processed a refund the day I went to return the item and let me keep the item anyway. A+++ service. Book arrived quickly in great condition and for a great price. Thank you so much! Amazing seller!
- n***c (94)- Votos emitidos por el comprador.Últimos 6 mesesCompra verificadaseller was communicative about my shipment, media mail took a while and tracking wasn't updated frequently, but seller communicated to me very quickly on status. the item came new and wrapped as described, though the packaging in it was packed wasn't sturdy and falling apart when it got to me.
AlibrisBooks
98,6% de votos positivos•1,9 millones artículos vendidos
Registrado como vendedor profesional
Votos de vendedor (513.985)
- m***m (2298)- Votos emitidos por el comprador.Últimos 6 mesesCompra verificadaI’m thrilled with my recent purchase . The website was user-friendly, and the product descriptions were accurate. Customer service was prompt and helpful, answering all my questions. My order arrived quickly, well-packaged, and the product exceeded my expectations in quality. I’m impressed with the attention to detail and the overall experience. I’ll definitely shop here again and highly recommend from this seller to others. Thank you for a fantastic experience!
- a***n (45)- Votos emitidos por el comprador.Últimos 6 mesesCompra verificadaMistakenly ordered a paperback that I thought was a hardcover, not sellers fault; it was described properly on the listing. Seller still processed a refund the day I went to return the item and let me keep the item anyway. A+++ service. Book arrived quickly in great condition and for a great price. Thank you so much! Amazing seller!
- n***c (94)- Votos emitidos por el comprador.Últimos 6 mesesCompra verificadaseller was communicative about my shipment, media mail took a while and tracking wasn't updated frequently, but seller communicated to me very quickly on status. the item came new and wrapped as described, though the packaging in it was packed wasn't sturdy and falling apart when it got to me.